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Book Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)

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Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)

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    Available in PDF - DJVU Format | Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging).pdf | Language: ENGLISH
    John W. Balde (Editor)

    Book details


Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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  • Pdf

*An electronic version of a printed book that can be read on a computer or handheld device designed specifically for this purpose.

Formats for this Ebook

PDF
Required Software Any PDF Reader, Apple Preview
Supported Devices Windows PC/PocketPC, Mac OS, Linux OS, Apple iPhone/iPod Touch.
# of Devices Unlimited
Flowing Text / Pages Pages
Printable? Yes

Book details

  • PDF | 376 pages
  • John W. Balde (Editor)
  • Springer: 2003 edition (31 Jan. 2003)
  • English
  • 8
  • Science Nature

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