Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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Formats for this Ebook
|Required Software||Any PDF Reader, Apple Preview|
|Supported Devices||Windows PC/PocketPC, Mac OS, Linux OS, Apple iPhone/iPod Touch.|
|# of Devices||Unlimited|
|Flowing Text / Pages||Pages|
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